Soldering of Printed Circuit Boards
The production of electronic assemblies is carried out using a variety of soldering methods. In most cases, electronic assemblies (printed circuit boards) are manufactured using reflow and wave or selective soldering machines.
The continuing trend towards further miniaturization of components and printed circuit boards, the use of new generations of active components (BGA, CSP, COD, DCP) and the introduction of lead-free solder materials are leading to an increasing demand for high-quality solder joints and reproducible processes.
This increases the demands on these soldering processes.
At the same time, however, the focus is on saving consumables and the energy needed to produce them.
The application of industrial gases in combination with new process technologies offers successful solutions here:
By inerting the soldering atmosphere with nitrogen the oxidation of the metal surfaces is prevented. The wetting of the surfaces with solder improves, which significantly reduces the number of soldering defects and increases the quality of the solder joints. Overall, nitrogen increases process safety, increases yield and extends the process window of the soldering machines.
The use of low-residue solder paste and flux is only possible with nitrogen or active gases (hydrogen). This eliminates complex cleaning processes.
In addition to the use of inert gases, especially nitrogen, for inerting the soldering systems, Messer also offers a retrofit system for wave soldering systems for the inertization of the soldering area.
The use of active gases not only suppresses oxide formation during the manufacturing process but also reduces existing oxides.
In the foreground of all applications for inerting the soldering atmosphere is always the generation of a stable and low-oxygen-poor soldering atmosphere. In addition, Messer offers its customers a comprehensive package of service measures. In addition to the provision of oxygen measuring devices, this also includes checking the residual oxygen concentration as a function of the amount of nitrogen used. Messer also offers technological support with regard to "inert gas soldering"
Messer has developed a technology in order to use the cold energy generated during the evaporation of the liquid nitrogen for cooling the reflow systems and the production halls. This "transfers" the obtained cooling energy into the cooling water circuit of our customers.
Your benefits at a glance
- Better wetting
- High quality of the solder joints
- Better solderability
- Less flux residue
- Less solder and flux required
- Less maintenance
- Less rework
- Easier inspection of the solder joints
- Greater process reliability
- Cost savings